Publication: Non-Contact Temperature Setting System for VLSI with High Heat Dissipation
Дата
2022
Авторы
Kostyuchenko, D.
Bobrovskiy, D.
Pechenkin, A.
Marfin, V.
Tsirkov, A.
Karakozov, A.
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© 2022 IEEE.It was required to develop a non-contact cooling system for conducting radiation research of VLSI with high heat generation. During the development process, various available methods for cooling products were considered and tested: immersion cooling and a cold-box - these methods did not bring the desired result.As a result, a cooling system was assembled based on the process of blowing the VLSI crystal with high-pressure compressed air. The system was based on an air compressor. The compressor was supplemented with external sensors to control the temperature of the samples and a control system for the output air flow. The entire process of setting the sample temperature was automatically controlled from a personal computer. The software and hardware parts of the solution are presented in this article.This non-contact cooling system has shown itself well in the conditions of real VLSI radiation research at physical facilities. However, in the future it is planned to improve a number of parameters in order to develop this cooling system to increase its efficiency.
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Non-Contact Temperature Setting System for VLSI with High Heat Dissipation / Kostyuchenko, D. [et al.] // Moscow Workshop on Electronic and Networking Technologies, MWENT 2022 - Proceedings. - 2022. - 10.1109/MWENT55238.2022.9802243