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Non-Contact Temperature Setting System for VLSI with High Heat Dissipation

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dc.contributor.authorKostyuchenko, D.
dc.contributor.authorBobrovskiy, D.
dc.contributor.authorPechenkin, A.
dc.contributor.authorMarfin, V.
dc.contributor.authorTsirkov, A.
dc.contributor.authorKarakozov, A.
dc.contributor.authorКостюченко, Денис Сергеевич
dc.contributor.authorБобровский, Дмитрий Владимирович
dc.contributor.authorПеченкин, Александр Александрович
dc.contributor.authorЦирков, Артем Николаевич
dc.date.accessioned2024-12-25T16:04:45Z
dc.date.available2024-12-25T16:04:45Z
dc.date.issued2022
dc.description.abstract© 2022 IEEE.It was required to develop a non-contact cooling system for conducting radiation research of VLSI with high heat generation. During the development process, various available methods for cooling products were considered and tested: immersion cooling and a cold-box - these methods did not bring the desired result.As a result, a cooling system was assembled based on the process of blowing the VLSI crystal with high-pressure compressed air. The system was based on an air compressor. The compressor was supplemented with external sensors to control the temperature of the samples and a control system for the output air flow. The entire process of setting the sample temperature was automatically controlled from a personal computer. The software and hardware parts of the solution are presented in this article.This non-contact cooling system has shown itself well in the conditions of real VLSI radiation research at physical facilities. However, in the future it is planned to improve a number of parameters in order to develop this cooling system to increase its efficiency.
dc.identifier.citationNon-Contact Temperature Setting System for VLSI with High Heat Dissipation / Kostyuchenko, D. [et al.] // Moscow Workshop on Electronic and Networking Technologies, MWENT 2022 - Proceedings. - 2022. - 10.1109/MWENT55238.2022.9802243
dc.identifier.doi10.1109/MWENT55238.2022.9802243
dc.identifier.urihttps://www.doi.org/10.1109/MWENT55238.2022.9802243
dc.identifier.urihttps://www.scopus.com/record/display.uri?eid=2-s2.0-85134006053&origin=resultslist
dc.identifier.urihttps://openrepository.mephi.ru/handle/123456789/28139
dc.relation.ispartofMoscow Workshop on Electronic and Networking Technologies, MWENT 2022 - Proceedings
dc.titleNon-Contact Temperature Setting System for VLSI with High Heat Dissipation
dc.typeConference Paper
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