Publication: Cu Metallization of Al2O3 Ceramic by Coating Deposition from Cooled- and Hot-Target Magnetrons
Дата
2023
Авторы
Kaziev, A. V.
Kolodko, D. V.
Lisenkov, V. Y.
Tumarkin, A. V.
Kharkov, M. M.
Samotaev, N. N.
Oblov, K. Y.
Journal Title
Journal ISSN
Volume Title
Издатель
Аннотация
We examined the feasibility of alumina substrate metallization by magnetron deposition of copper coatings with thickness of several tens Вµm for its prospective applications in production of ceramic PCBs and packaging. The films were prepared in magnetron sputtering systems with cooled and thermally insulated (hot) targets. Substrates with different geometries were used, including those with through-holes. Thickness, adhesive properties, and electrical resistivity of produced coatings were analyzed. If the film thickness exceeded ~20 Вµm, we observed its systematic delamination, unless the dedicated CuxOy sub-layer of was introduced between the substrate and the main Cu film. Intermediate copper oxide films were investigated separately by SEM, EDS, and XRD methods, and deposition conditions for predominant growth of favorable tenorite CuO were determined. Prepared composite two-layer CuO + Cu coatings with total thickness of ~100 Вµm demonstrated good adhesion to alumina substrates in scratch-testing and performed much better than Cu-only films both in soldering and thermal cycling tests. We discuss an approach for constructing a reliable metallizing coating by plasma-assisted PVD methods that could be beneficial for complex-shaped ceramic PCBs and packaging.
Описание
Ключевые слова
Metallizing , Copper Metallization , Cavity magnetron , Delamination (geology) , Deposition (geology) , Temperature cycling
Цитирование
Cu Metallization of Al2O3 Ceramic by Coating Deposition from Cooled- and Hot-Target Magnetrons / Kaziev, A. V. [et al.] // Coatings. - 2023. - 13. - № 2. - 10.3390/coatings13020238
URI
https://www.doi.org/10.3390/coatings13020238
https://www.scopus.com/record/display.uri?eid=2-s2.0-85149071046&origin=resultslist
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https://openrepository.mephi.ru/handle/123456789/30007
https://www.scopus.com/record/display.uri?eid=2-s2.0-85149071046&origin=resultslist
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Alerting&SrcApp=Alerting&DestApp=WOS_CPL&DestLinkType=FullRecord&UT=WOS:000938449600001
https://openrepository.mephi.ru/handle/123456789/30007