Publication: Temperature influence on process of Ti/Al/Ni/Au contact formation to heterostructure AlGaN/GaN
Дата
2019
Авторы
Shostachenko, S. A.
Porokhonko, Y. A.
Zakharchenko, R. V.
Leshchev, S. V.
Maslov, M. M.
Katin, K. P.
Journal Title
Journal ISSN
Volume Title
Издатель
Аннотация
© 2019 Published under licence by IOP Publishing Ltd. This paper is dedicated to the experimental investigation of Ohmic contacts to the n+-doped region of the AlGaN/GaN transistor heterostructure based on Ti/Al/Ni/Au metallization. The Al-Ti-N system has been assessed on the basis of available thermodynamic descriptions for binary subsystems. The effect of annealing temperature on the specific resistance of Ohmic contact was studied.
Описание
Ключевые слова
Цитирование
Temperature influence on process of Ti/Al/Ni/Au contact formation to heterostructure AlGaN/GaN / Shostachenko, S.A. [et al.] // IOP Conference Series: Materials Science and Engineering. - 2019. - 498. - № 1. - 10.1088/1757-899X/498/1/012019
URI
https://www.doi.org/10.1088/1757-899X/498/1/012019
https://www.scopus.com/record/display.uri?eid=2-s2.0-85065596218&origin=resultslist
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Alerting&SrcApp=Alerting&DestApp=WOS_CPL&DestLinkType=FullRecord&UT=WOS:000472784800019
https://openrepository.mephi.ru/handle/123456789/17950
https://www.scopus.com/record/display.uri?eid=2-s2.0-85065596218&origin=resultslist
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Alerting&SrcApp=Alerting&DestApp=WOS_CPL&DestLinkType=FullRecord&UT=WOS:000472784800019
https://openrepository.mephi.ru/handle/123456789/17950