Publication: 3D Silicon Photonic Structures Based on Avalanche LED with Interconnections through Optical Interposer
Дата
2019
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Аннотация
Design and manufacturing technology of 3D silicon photonic structures with optical interconnections through microchannel vias interposers were developed. Silicon chips placed over each other were separated by the silicon microchannel vias interposer served as a light wave-guide. Light emitting diodes and photodiodes were formed at the inner surfaces of silicon chips from nanostructured silicon clusters embedded into alumina matrix. The developed structure is characterized by the current conversion efficiency of 0.1% and can operate in the GHz frequency range.
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Цитирование
3D Silicon Photonic Structures Based on Avalanche LED with Interconnections through Optical Interposer / Leshok, AA [et al.] // International Journal of Nanoscience. - 2019. - 18. - № 3-4. - 10.1142/S0219581X1940091X
URI
https://www.doi.org/10.1142/S0219581X1940091X
https://www.scopus.com/record/display.uri?eid=2-s2.0-85068109457&origin=resultslist
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https://openrepository.mephi.ru/handle/123456789/18328
https://www.scopus.com/record/display.uri?eid=2-s2.0-85068109457&origin=resultslist
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Alerting&SrcApp=Alerting&DestApp=WOS_CPL&DestLinkType=FullRecord&UT=WOS:000472775200092
https://openrepository.mephi.ru/handle/123456789/18328