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Electronic Components Authentication Methods Based on Visual and Chemical Package Analysis

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dc.contributor.authorShirin, A. O.
dc.contributor.authorKoval, K. A.
dc.contributor.authorTaiibov, F. F.
dc.contributor.authorKameneva, A. S.
dc.contributor.authorKessarinskiy, L. N.
dc.contributor.authorDurakovskiy, A. P.
dc.contributor.authorКоваль, Кирилл Александрович
dc.contributor.authorКессаринский, Леонид Николаевич
dc.contributor.authorДураковский, Анатолий Петрович
dc.date.accessioned2024-11-29T22:36:03Z
dc.date.available2024-11-29T22:36:03Z
dc.date.issued2021
dc.description.abstract© 2021 IEEE.The work is devoted to counterfeiting electronic components. The results of the use of visual analysis of the surface and marking are presented. Only the use of a set of methods allows you to give a reliable result. The optimal set of methods is determined by the qualifications of the researcher.
dc.format.extentС. 115-117
dc.identifier.citationElectronic Components Authentication Methods Based on Visual and Chemical Package Analysis / Shirin, A.O. [et al.] // Proceedings of the International Conference on Microelectronics, ICM. - 2021. - 2021-September. - P. 115-117. - 10.1109/MIEL52794.2021.9569171
dc.identifier.doi10.1109/MIEL52794.2021.9569171
dc.identifier.urihttps://www.doi.org/10.1109/MIEL52794.2021.9569171
dc.identifier.urihttps://www.scopus.com/record/display.uri?eid=2-s2.0-85118439138&origin=resultslist
dc.identifier.urihttps://openrepository.mephi.ru/handle/123456789/24915
dc.relation.ispartofProceedings of the International Conference on Microelectronics, ICM
dc.titleElectronic Components Authentication Methods Based on Visual and Chemical Package Analysis
dc.typeConference Paper
dspace.entity.typePublication
oaire.citation.volume2021-September
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