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Optimization of the 3D-IC model structure

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dc.contributor.authorAralov, M. N.
dc.contributor.authorBarabanov, V. F.
dc.contributor.authorKravets, O. Ja.
dc.contributor.authorNuzhny, A. M.
dc.contributor.authorVarlamov, N. V.
dc.contributor.authorВарламов, Николай Викторович
dc.date.accessioned2024-11-21T08:30:00Z
dc.date.available2024-11-21T08:30:00Z
dc.date.issued2019
dc.description.abstract© 2019 Published under licence by IOP Publishing Ltd. This article describes an algorithm of optimizing the placement of the main constituent elements of 3-D integrated VLSI circuits. To solve the formulated problem of optimization, it is proposed to use a modified genetic algorithm. The proposed algorithms, models and methods have been implemented in the software. The article presents the structural scheme and the results of the developed software.
dc.identifier.citationOptimization of the 3D-IC model structure / Aralov, M.N. [et al.] // IOP Conference Series: Materials Science and Engineering. - 2019. - 498. - № 1. - 10.1088/1757-899X/498/1/012039
dc.identifier.doi10.1088/1757-899X/498/1/012039
dc.identifier.urihttps://www.doi.org/10.1088/1757-899X/498/1/012039
dc.identifier.urihttps://www.scopus.com/record/display.uri?eid=2-s2.0-85065591570&origin=resultslist
dc.identifier.urihttp://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Alerting&SrcApp=Alerting&DestApp=WOS_CPL&DestLinkType=FullRecord&UT=WOS:000472784800039
dc.identifier.urihttps://openrepository.mephi.ru/handle/123456789/17986
dc.relation.ispartofIOP Conference Series: Materials Science and Engineering
dc.titleOptimization of the 3D-IC model structure
dc.typeConference Paper
dspace.entity.typePublication
oaire.citation.issue1
oaire.citation.volume498
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