Publication:
The microstructure of rapidly quenched TiNiCu ribbons crystallized by isothermal and electropulse treatments

Дата
2020
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Научные группы
Организационные подразделения
Организационная единица
Институт лазерных и плазменных технологий
Стратегическая цель Института ЛаПлаз – стать ведущей научной школой и ядром развития инноваций по лазерным, плазменным, радиационным и ускорительным технологиям, с уникальными образовательными программами, востребованными на российском и мировом рынке образовательных услуг.
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Аннотация
© 2020 IOP Publishing Ltd. All rights reserved.The work is devoted to the study of the effect of isothermal and electropulse heat treatments on the structure of Ti50Ni25Cu25 (at.%) alloy with the shape-memory effect. The alloy was fabricated by rapid quenching from the liquid state (melt spinning technique) at the cooling rate of the melt of about 106 K/s in the form of a layered amorphous-crystalline ribbon with a thickness of 28 μm. To obtain a completely amorphous state, the ribbon thickness was reduced to 22 μm by means of electrochemical polishing. The alloy samples were subjected to the electropulse treatment (dynamic crystallization) by passing a single electric current pulse with a duration of 10 ms through the sample. The electron microscopy and X-ray diffraction studies have shown that electropulse treatment leads to a significant change in the crystalline structure being formed, in comparison with that obtained by isothermal crystallization. It was revealed that after dynamic crystallization, the microstructure of alloys in cross-section has a non-uniform distribution of crystals (grains) over the ribbon thickness. A structure of columnar crystals is formed near the ribbon surfaces, while individual crystals or grouped large crystals are present in the ribbon bulk. In addition, the columnar structure is textured.
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The microstructure of rapidly quenched TiNiCu ribbons crystallized by isothermal and electropulse treatments / Sitnikov, N.N. [et al.] // IOP Conference Series: Materials Science and Engineering. - 2020. - 770. - № 1. - 10.1088/1757-899X/770/1/012088
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